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Electronic Components
Photovoltaics Packaging
Semiconductors
packaging paste for semiconductor
Specialty Pastes

Die Attach Paste

HS-411 silver paste is designed for chip (such as LED/IC) packaging.

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Nano-Sintered Materials

HS-401 is a nano sintered silver paste. It can be used for high power modules (such as IGBT) packaging. It has high thermal conductivity, high electrical conductivity and high reliability.

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Email Address:hs-tech@huashengchn.com

Contact person:Mr Ji

Phone:+86-411-39554099

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